We are able to populate parts on many different boards from:
  • FR4 to Aluminum assembly
  • Flex Circuit Board
  • Rigid-Flex Circuit Board
Our feature SMT machines are able to achieve the following:
  • Placing accuracy of 3 sigma: 35 micron
  • Min component size: 0.6 x0.3 mm
  • Max component size: 45x100 mm
  • Max component height: 11mm
  • Min board size (LxW): 50 x 50 mm
  • Max board size (LxW): 460 x 440 mm
  • Large Board Application: 650 x 850 mm
  • Board thickness: 0.4 to 4.0 mm
And our SMT component installation capabilities include:
  • LGA
  • BGA
  • uBGA
  • QFN
  • QFP
  • TQFP
  • 01005 Resistor/ Capacitors
  • SOT
  • SOIC
  • MELF
  • PLCC

We are also able to install through-hole parts and we feature a Hepco radial cutter and DIP former, and APS axial and radial lead formers.
Our wave soldering system features an ultrasonic spray fluxer that not only keeps our production costs down but most importantly maintains a controlled no-clean wave soldering process.

We adhere to IPC-610 standards and guidelines and our staff is trained according to these standards as well as to customer-specific requirements. Our belief in machine reliability and dependability have lead us to equip our facility with manufacturing equipment made by leaders in the industry; namely DEK, Assembleon (formerly Philips EMT), Conceptronic, Sono-Tek, and Vitronics-Soltec.

At MicroPlace, Inc., we will provide quality work for a reliable product.

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